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Numerical modeling of silicon film deposition in very-high-frequency plasma reactor

  • Mitsubishi Heavy Industries, Ltd.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

We present a numerical modeling of plasma-enhanced chemical vapor deposition (PECVD) of silicon film from SiH4 and H2 gas mixtures in very-high-frequency (VHF) plasma reactor. The model is composed by electron impact, gas-phase, and surface reactions in a well-mixed reactor model. A set of plasma parameters such as electron density, electron temperature and electron impact reaction rates is determined separately by nonequilibrium plasma model and used as inputs for well-mixed reactor models. The gas-phase reactions include electron impact and neutral-neutral reactions. Some of unknown rates of surface reactions are determined using quantum chemical calculations and transition state theory. In well-mixed reactor models, concentrations of each chemical species are calculated in a steady state condition using mass conservation equation uniformed through the reactor. Numerical results of growth rate as a function of plasma reactor operating parameters show good agreement with experimental ones. Finally optimal operating parameters are investigated using our model combined with design of experiments and optimization techniques.

Original languageEnglish
Title of host publication2002 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages135-138
Number of pages4
ISBN (Electronic)4891140275
DOIs
StatePublished - 2002
Externally publishedYes
EventInternational Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2002 - Kobe, Japan
Duration: 4 Sep 2002 → 6 Sep 2002

Publication series

NameInternational Conference on Simulation of Semiconductor Processes and Devices, SISPAD
Volume2002-January

Conference

ConferenceInternational Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2002
Country/TerritoryJapan
CityKobe
Period4/09/02 → 6/09/02

Keywords

  • Chemical vapor deposition
  • Electrons
  • Inductors
  • Numerical models
  • Plasma chemistry
  • Plasma density
  • Plasma temperature
  • Quantum mechanics
  • Semiconductor films
  • Silicon

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