AN ALTERNATIVE CORRELATING PARAMETER FOR CREEP CRACK-GROWTH RATE AND ITS APPLICATION - DERIVATION OF THE PARAMETER Q-ASTERISK

AT YOKOBORI; T YOKOBORI; T NISHIHARA; T YAMAOKA

AN ALTERNATIVE CORRELATING PARAMETER FOR CREEP CRACK-GROWTH RATE AND ITS APPLICATION - DERIVATION OF THE PARAMETER Q-ASTERISK

AT YOKOBORI, T YOKOBORI, T NISHIHARA, T YAMAOKA

Advanced Comprehensive Research Organization

Research output: Contribution to journal › Article

Abstract

The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/dt, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.

Original language	English
Pages (from-to)	108-118
Number of pages	11
Journal	MATERIALS AT HIGH TEMPERATURES
Volume	10
Issue number	2
State	Published - May 1992

Cite this

@article{85e3417cc9da43f5b8e5d5f82ef6a8c2,

title = "AN ALTERNATIVE CORRELATING PARAMETER FOR CREEP CRACK-GROWTH RATE AND ITS APPLICATION - DERIVATION OF THE PARAMETER Q-ASTERISK",

abstract = "The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/dt, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.",

author = "AT YOKOBORI and T YOKOBORI and T NISHIHARA and T YAMAOKA",

year = "1992",

month = may,

language = "英語",

volume = "10",

pages = "108--118",

journal = "MATERIALS AT HIGH TEMPERATURES",

issn = "0960-3409",

publisher = "TAYLOR \& FRANCIS LTD",

number = "2",

}

TY - JOUR

T1 - AN ALTERNATIVE CORRELATING PARAMETER FOR CREEP CRACK-GROWTH RATE AND ITS APPLICATION - DERIVATION OF THE PARAMETER Q-ASTERISK

AU - YOKOBORI, AT

AU - YOKOBORI, T

AU - NISHIHARA, T

AU - YAMAOKA, T

PY - 1992/5

Y1 - 1992/5

N2 - The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/dt, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.

AB - The parameter Q* has been proposed for correlating or characterizing creep crack growth rate. The creep crack growth rate has been expressed in terms of an activation process equation, and the parameter Q* was defined as the exponent of the exponential in the thermal activation process equation for da/dt, in which the activation energy is expressed in terms of free energy. CrMoV steel was used for VAMAS round-robin tests, and other materials such as SUS 304 and the Ni-base alloy of Hastelloy-XR were used. For these materials good correlations are obtained. An analytical conclusion about the effect of thickness on crack growth is described.

M3 - 記事

SN - 0960-3409

VL - 10

SP - 108

EP - 118

JO - MATERIALS AT HIGH TEMPERATURES

JF - MATERIALS AT HIGH TEMPERATURES

IS - 2

ER -

AN ALTERNATIVE CORRELATING PARAMETER FOR CREEP CRACK-GROWTH RATE AND ITS APPLICATION - DERIVATION OF THE PARAMETER Q-ASTERISK

Abstract

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